II‐VI Incorporated to Showcase Innovations for Optical Networks at OFC 2017
PITTSBURGH, March 20, 2017 (GLOBE NEWSWIRE) – II‐VI Incorporated (NASDAQ:IIVI), a global leader in engineered materials and optical solutions for networks, will exhibit at the Optical Fiber Communication Conference and Exhibition (OFC) in Los Angeles, California, on March 21-23, 2017, in Booth #2101.
II-VI is increasingly leveraging its innovation leadership in its semiconductor and micro-optics technology platforms to create the next set of breakthroughs in miniaturized solutions. These will enable novel monitoring solutions for transport networks, compact amplifier solutions for high bit-rate DWDM transceivers, as well as key devices and sub-assemblies for datacenter transceivers. The new products showcased at OFC include the following:
- 3-pin 980 nm micro-pump laser: II-VI achieves a new breakthrough in miniaturization with its 980 nm micro-pump laser that measures only 141 cubic millimeters in volume to enable optical amplification within emerging small pluggable transceiver packages.
- Miniature MEMS tunable optical filter (mini-MTOF) with variable optical attenuator (VOA): The new mini-MTOF filters out optical noise to improve the signal fidelity in high bit rate transmission. Its low 4.8 mm profile fits in pluggable module form factors and the VOA function removes the need for a separate device.
- Pluggable Optical Time Domain Reflectometer (OTDR): II-VI’s pluggable OTDR is a new module designed for embedded network monitoring applications in carrier and data center networks to monitor fiber plant quality.
- 25 Gb/s detector chip array: II-VI’s newly developed 25 Gb/s detector chips enable 100 Gb/s short-reach transmission in active optical cables and transceivers. The high speed detectors feature large 40 µm diameter apertures that greatly facilitate arrayed-receiver assembly manufacturing.
- Z-block mux/demux micro-optics assembly: Designed for 100 Gb/s datacenter transceivers, the Z-block is a new micro-optics precision mux/demux assembly in an extremely small 1.5 x 1.0 x 1.35 mm size that fits in a standard CFP4 or QSFP package.